Chip Partners has developed comprehensive testing criteria for non-factory sealed products including:

Chip Partners has developed comprehensive testing criteria for non-factory sealed components in a BGA or PGA package including:

• Complete microscopic visual examination- a comprehensive visual test that verifies the integrity of the package, leads, pins, solder balls and substrate
• Marking permanency test- verifies the identity of the part
• Sample decapsulation- all parts that are received in a non-factory sealed condition will have a sample decapsulated to verify that the chip id# matches the part number
• Additional testing- available both at Chip Partners and our third party test companies per customer’s requirements